Space-Borne System-in-Package Based on High Reliability Microwave Interconnections

نویسندگان

چکیده

With the increasing demand for multi-function and highly integrated space-borne microwave products, a three-dimensional heterogeneous integration based on special substrates other systems-in-package has difficulty with meeting requirements of high reliability in space. Through simulation, thermal-deformation resistance traditional interconnections meets reliability, but its transmission performance at frequency is poor. Based above, novel horizontal coaxial transition structure good excellent characteristics proposed. The design formula derived, basic size can be quickly calculated. vertical matching realize interconnection by combining microstrip impedance transformation gold-ribbon interconnection. complex circuit laid out partitioned way, thus metallic system-in-package method implemented. A Ka-band receiving used as an example to carry actual test validation. better channel satellite are obtained, verified temperature cycle mechanical vibration test.

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ژورنال

عنوان ژورنال: Electronics

سال: 2023

ISSN: ['2079-9292']

DOI: https://doi.org/10.3390/electronics12051122